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铜核球 Copper core solder ball

锡基电子材料类

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POP锡膏 MT-POP330

锡基电子材料类

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<p><strong><span style="font-size:19px;font-family:宋体;color:black">为应对</span></strong><strong><span style="font-size:19px;color:black"> POP</span></strong><strong><span style="font-size: 19px;font-family:宋体;color:black">组件封装</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">、大功率器件、电源及二次回流焊需求</span></strong><strong><span style="font-size:19px;color:black">,</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">本公司推出专用型锡膏</span></strong><strong><span style="font-size:19px;color:black">,</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">使用助焊剂和纳米焊粉，以最大程度减少回流过程中与非平面处理器</span></strong><strong><span style="font-size:19px;color:black">/</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">内存组合相关的缺陷。此款锡膏可以通过桥接单独的</span></strong><strong><span style="font-size:19px;color:black">POP</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">助焊剂可能无法消除的间隙，帮助减少与将已知的良好存储设备焊接到已知的良好处理器封装相关的昂贵缺陷</span></strong><strong><span style="font-size:19px;color:black">.</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">此规格是一款免清洗的无铅焊膏。通过优化超细焊料粉和助焊剂的物理性能，它非常适合</span></strong><strong><span style="font-size:19px;color:black">POP,BGA</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">封装及需要二次回流的封装，同时留下具有高电阻率的透明，无色残留物。</span></strong></p><p><strong><span style="font-size:19px;font-family:宋体;color:black">优势</span></strong><strong><span style="font-size:19px;color:black">:</span></strong></p><p class="MsoListParagraph" style="margin-left:24px"><strong><span style="font-size:19px;color:black">1.<span style="font-variant-numeric: normal;font-variant-east-asian: normal;font-weight: normal;font-stretch: normal;font-size: 9px;line-height: normal;font-family: 'Times New Roman'">    </span></span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">焊接后抑制空隙产生</span></strong></p><p class="MsoListParagraph" style="margin-left:24px"><strong><span style="font-size:19px;color:black">2.<span style="font-variant-numeric: normal;font-variant-east-asian: normal;font-weight: normal;font-stretch: normal;font-size: 9px;line-height: normal;font-family: 'Times New Roman'">    </span></span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">在焊接区域形成分健壮的</span></strong><strong><span style="font-size:19px;color:black">IMC</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">骨架结构</span></strong></p><p class="MsoListParagraph" style="margin-left:24px"><strong><span style="font-size:19px;color:black">3.<span style="font-variant-numeric: normal;font-variant-east-asian: normal;font-weight: normal;font-stretch: normal;font-size: 9px;line-height: normal;font-family: 'Times New Roman'">    </span></span></strong><strong><span style="font-size:19px;color:black">IMC</span></strong><strong><span style="font-size:19px;font-family:宋体;color:black">比普通型锡膏稳定且坚固</span></strong></p><p><br/></p>
POP 助焊膏

锡基电子材料类

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CCGA锡柱

锡基电子材料类

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<p><strong><span style="font-size: 12px;">CCGA锡柱<br/>绕铜带螺旋柱<br/>铜核球</span></strong><br/></p>
晶圆植球FLUX

锡基电子材料类

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无铅锡膏

锡基电子材料类

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不锈钢助焊膏

锡基电子材料类

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IGBT 多路加热器

热控试验拆焊类

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