Copper core solder ball

0.22mm  MT-Cu022

   (0.12-0.6mm)

本产品以其能够实现封装空间稳定而成为3D堆叠封装的优秀解决方案，同时本产品能够应用在窄间距封装领域。

This product is an excellent solution for 3D stack packaging because of its ability to achieve stable packaging space, and this product can be used in the field of narrow-pitch packaging.

更精密的尺寸和公差控制.

更优异的导电和导热性能.

稳定的封装空间.

低电迁移。

Cu core solder ball has possibility that is used same solder ball process.

The melting point of copper core is over 1,000℃, so it keeps the stand off after reflow.

铜核有助于保持均匀和高精度的板间距。

铜核防止不湿，确保连接稳定。

铜核提供出色的导热性和导电性。