The bottom filled plastic (underfill) is one part epoxy sealants, used to CSP&BGA bottom filling process. It can form the consistent and fill in the bottom of the no defects
Filling layer, can effectively reduce the silicon chips and the board between overall temperature characteristics do not match or expansion the impact of external force. Low viscosity properties that make it better
To fill the bottom; Higher liquidity to strengthen its repair maneuverability.

Typical application: 1, mobile equipment production process, in which use to CSP/BGA/Flip Chip/FBGA processes;
2, the use of the bottom filling process to improve thermal shock and vibration resistance performance.
Typical performance
-high reliability-high liquidity-fast curing-long life-easy storage operation-can repair
-automatic Angle accidentally fill in secret-fill 0.5 dense ears (0.013 mm) clearance