Heat sink

Characteristic advantage:
Had high reliability
-vice compressibility is strong, soft and elastic
Had high thermal conductivity
-vice natural viscous, without additional surface forehead bonding
Meet the ROHS and transiting the UL environmental requirements
-vice arbitrary length (1.5 meters)
Type (1)
In the heat of the heating element with big (such as: product main IC, power tube, large capacitance, big inductance aluminum plate and shell heat sink or between the filling, insulation, shock, heat conduction role. And tighten device.
(2) the glass fiber type
Mainly used in heat source with pins (such as LAMP LED) and heat sink or shell on filling, between insulation, shockproof, heat conduction role. And a fastening devices.
(3) rubber type back
Rubber type products have single back back glue and double back glue.
One main is easy to thermal conductive rubber back the installation of silica gel joint, such as a back light using thermal conductive silicone size for 452 * 5.5 so long size for easy installation, for some use single back glue, thermal conductive silicone rubber side have posted in the PCB board, the other side posted on the housing.
Double back glue mainly because product without fixed device or not convenient fixed. So need to double back glue, will IC and heat sink to stick.
(3) the special LED
Is a high performance thermal conductive materials, designed to meet the LED lighting (PCB/aluminum plate) reduce the temperature of the heat conduction work role. SP160 series itself inherent viscosity, soft, good compression performance and has good heat transfer rate. Along with its low thermal resistance and the characteristics of higher performance to price ratio is widely used for photoelectric industry high power LED lighting PCB board and heat sink to solve thermal conductivity between high power LED lighting heat conductivity, the best choice materials heat.

Application modes
A. thermal conductivity of silica gel stick in the aluminum plate (PCB) and lighting between heat sink.
B. thermal conductivity of silica gel stick in the aluminum plate (PCB) and lighting between shell.
C. The thermal conductivity of silica gel stick in the aluminum plate (PCB) and aluminum plate between
Specifications unit
Color Color/blue
Heat impedance Thermal impedance @ 0.5 ℃ in2 / W 0.6
The proportion of Specific Gravity g/cm3 2.0
Volume resistance Volume Resistivity Ω CM 1011 Ω
Heat conduction coefficient of Thermal Conductivity W/mk 3.0
Breakdown Voltage Breakdown Voltage KV/mm 6
Thickness (plus or minus 10%) Thickness mm 0.5 ~ 15
Hardness Hardness Shore 0 15 ± 5
Fire prevention level Flammability class/UL94-VO
Using temperature Application temperature /-40 ~ + 200
Self-adhesive Self-adhesive/super soft/double super since the sticky
Back glue Tape Choose/rather than hand-writing choice
Fiber reinforced Fiber Strengthen/quality indicator